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10M50DAF672C8G
IC FPGA 500 I/O 672FBGA
- メーカー
- Mfr。パート #10M50DAF672C8G
- パッケージ
- データシート
- 在庫中5854
100% オリジナル &新しい
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365日の保証
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仕様
| Series | MAX® 10 |
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Number of LABs/CLBs | 3125 |
| Number of Logic Elements/Cells | 50000 |
| Total RAM Bits | 1677312 |
| Number of I/O | 500 |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | 672-BGA |
| Supplier Device Package | 672-FBGA (27x27) |
| Packaging | Tray |
概要
Description
The 10M50DAF672C8G is a part of Intel's MAX 10 FPGA (Field-Programmable Gate Array) family, designed to deliver low power consumption, high performance, and cost-effectiveness. This particular model features 50,000 logic elements, making it suitable for a variety of applications ranging from industrial automation to consumer electronics.
The FPGA integrates several functionalities such as analog-to-digital converters (ADCs), flash memory, and digital signal processing (DSP) blocks. It operates with a single power supply, simplifying the design and reducing the overall system cost. The 10M50DAF672C8G comes in a 672-pin FineLine BGA package, providing ample I/O options for complex designs.
Additionally, the MAX 10 series includes features such as instant-on configuration, Nios II soft processor support, and a wide operating temperature range, which enhances its versatility for different environments. Overall, this FPGA is ideal for designers seeking a balance between performance, integration, and cost in their embedded system designs.
The FPGA integrates several functionalities such as analog-to-digital converters (ADCs), flash memory, and digital signal processing (DSP) blocks. It operates with a single power supply, simplifying the design and reducing the overall system cost. The 10M50DAF672C8G comes in a 672-pin FineLine BGA package, providing ample I/O options for complex designs.
Additionally, the MAX 10 series includes features such as instant-on configuration, Nios II soft processor support, and a wide operating temperature range, which enhances its versatility for different environments. Overall, this FPGA is ideal for designers seeking a balance between performance, integration, and cost in their embedded system designs.
Features
The 10M50DAF672C8G is part of the Intel MAX 10 FPGA family. Key features include:
1. Logic Elements: It contains 50,000 logic elements, providing significant capacity for diverse applications.
2. Embedded Memory: Includes memory blocks with a total capacity of 1,677 Kbits, suitable for a variety of data storage needs.
3. Digital Signal Processing: Equipped with DSP blocks that enhance performance for signal processing applications.
4. I/O Pins: Offers up to 360 user I/O pins, enabling extensive interfacing with other components and systems.
5. On-chip Flash: Features integrated dual-configuration flash, allowing for configuration flexibility and instant-on functionality.
6. Analog-to-Digital Converter: Incorporates ADC capabilities, supporting mixed-signal applications.
7. Embedded Processor Capability: Supports Nios II soft processor for embedded processing tasks.
8. Temperature Range: Available in industrial-grade temperature ranges, making it suitable for various environmental conditions.
9. Power Management: Includes power management features like power-down mode for energy efficiency.
10. Package: Comes in a 672-pin BGA package, providing a compact form factor for high-density designs.
These features make the 10M50DAF672C8G a versatile choice for applications in industrial, automotive, and consumer electronics.
1. Logic Elements: It contains 50,000 logic elements, providing significant capacity for diverse applications.
2. Embedded Memory: Includes memory blocks with a total capacity of 1,677 Kbits, suitable for a variety of data storage needs.
3. Digital Signal Processing: Equipped with DSP blocks that enhance performance for signal processing applications.
4. I/O Pins: Offers up to 360 user I/O pins, enabling extensive interfacing with other components and systems.
5. On-chip Flash: Features integrated dual-configuration flash, allowing for configuration flexibility and instant-on functionality.
6. Analog-to-Digital Converter: Incorporates ADC capabilities, supporting mixed-signal applications.
7. Embedded Processor Capability: Supports Nios II soft processor for embedded processing tasks.
8. Temperature Range: Available in industrial-grade temperature ranges, making it suitable for various environmental conditions.
9. Power Management: Includes power management features like power-down mode for energy efficiency.
10. Package: Comes in a 672-pin BGA package, providing a compact form factor for high-density designs.
These features make the 10M50DAF672C8G a versatile choice for applications in industrial, automotive, and consumer electronics.
Package
The 10M50DAF672C8G is part of Intel's MAX 10 FPGA family and comes in a 672-pin FineLine BGA (Ball Grid Array) package.
Pinout
The 10M50DAF672C8G is a member of the Intel MAX 10 FPGA family. It features a FineLine BGA package with 672 pins.
Key functions of the 10M50DAF672C8G include:
- FPGA Fabric: It provides programmable logic for implementing custom hardware designs.
- Embedded Memory: It includes built-in memory blocks for data storage and processing.
- DSP Blocks: This device has dedicated digital signal processing blocks for efficient handling of arithmetic operations.
- Embedded Processor: It supports Nios II soft processors and other intellectual property cores.
- I/O Features: The device supports various I/O standards, including LVDS, making it suitable for high-speed data transfer.
- Configuration Options: It supports dual configuration images, allowing for system redundancy and upgrades.
- Power Management: The FPGA includes power optimization features to reduce consumption.
These features make it suitable for a variety of applications in areas such as industrial, automotive, and consumer electronics. For detailed specifications, refer to Intel's official datasheets and technical documents.
Key functions of the 10M50DAF672C8G include:
- FPGA Fabric: It provides programmable logic for implementing custom hardware designs.
- Embedded Memory: It includes built-in memory blocks for data storage and processing.
- DSP Blocks: This device has dedicated digital signal processing blocks for efficient handling of arithmetic operations.
- Embedded Processor: It supports Nios II soft processors and other intellectual property cores.
- I/O Features: The device supports various I/O standards, including LVDS, making it suitable for high-speed data transfer.
- Configuration Options: It supports dual configuration images, allowing for system redundancy and upgrades.
- Power Management: The FPGA includes power optimization features to reduce consumption.
These features make it suitable for a variety of applications in areas such as industrial, automotive, and consumer electronics. For detailed specifications, refer to Intel's official datasheets and technical documents.
Manufacturer
The 10M50DAF672C8G is a part of the MAX 10 series of FPGAs manufactured by Intel Corporation. Intel is a multinational corporation known for designing and manufacturing semiconductor products, including microprocessors, integrated graphics, and FPGAs (field-programmable gate arrays). The company is recognized as a major player in the technology industry and primarily operates in the areas of computer hardware and software, with a significant focus on semiconductor design and innovation.
Application
The 10M50DAF672C8G is a member of the Intel MAX 10 FPGA family, known for low power consumption and integrated flash. It's used in applications requiring flexible and cost-effective solutions, such as industrial automation, communications, automotive systems, and consumer electronics. Key uses include signal processing, control logic, interface bridging, and simple system management tasks. Its non-volatile configuration memory and instant-on capabilities make it suitable for systems needing quick startup and reliable operation.
Equivalent
The 10M50DAF672C8G is part of the Intel MAX 10 FPGA family. Equivalent products would typically be other models within the MAX 10 series with similar specifications, such as the 10M50DCF484C8G, which offer comparable logic elements and I/O counts. However, specific equivalents may vary based on the exact requirements and configurations needed, such as package type or temperature range. Always ensure compatibility with your application's specific needs.
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出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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