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10AX016E4F27E3SG
IC FPGA 240 I/O 672FBGA
- メーカー
- Mfr。パート #10AX016E4F27E3SG
- パッケージ FBGA-672
- データシート
- 在庫中2613
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
RFQおよびもっと割引を得る
仕様
| Package | Tray |
| Series | Arria 10 GX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 61510 |
| NumberofLogicElements/Cells | 160000 |
| TotalRAMBits | 10086400 |
| NumberofI/O | 240 |
| Voltage-Supply | 0.87V ~ 0.93V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package/Case | 672-BBGA, FCBGA |
概要
Description
The code "10AX016E4F27E3SG" refers to a specific FPGA (Field-Programmable Gate Array) model from Intel's Arria 10 family. These FPGAs are designed for high-performance applications, offering a combination of logic density, DSP (Digital Signal Processing) capabilities, and high-speed transceivers.
Key features include:
- Logic Elements: Provides a large number of configurable logic blocks.
- DSP Blocks: Optimized for intensive computational tasks, enhancing performance in signal processing.
- Memory: Integrated memory resources for efficient data handling.
- Transceivers: Supports high-speed data communication, ideal for networking and storage applications.
- Power Efficiency: Designed for low power consumption while maintaining performance.
Common applications include telecommunications, automotive, industrial automation, and data centers. The model number can help identify specific configurations and features, such as memory size and packaging options.
Key features include:
- Logic Elements: Provides a large number of configurable logic blocks.
- DSP Blocks: Optimized for intensive computational tasks, enhancing performance in signal processing.
- Memory: Integrated memory resources for efficient data handling.
- Transceivers: Supports high-speed data communication, ideal for networking and storage applications.
- Power Efficiency: Designed for low power consumption while maintaining performance.
Common applications include telecommunications, automotive, industrial automation, and data centers. The model number can help identify specific configurations and features, such as memory size and packaging options.
Features
The 10AX016E4F27E3SG is a member of Intel's Agilex FPGA family, specifically designed for high-performance and efficiency applications. Key features include:
1. Architecture: Utilizes a 10nm process technology for improved power efficiency and performance.
2. Logic Elements: Contains 16,000 adaptive logic modules (ALMs) for flexible logic implementation.
3. DSP Blocks: Integrates digital signal processing (DSP) blocks optimized for high-speed arithmetic operations.
4. Memory: Features on-chip memory resources, including SRAM and configuration memories for enhanced data handling.
5. I/O Capabilities: Supports high-speed I/O interfaces, allowing for a range of connectivity options including PCIe and Ethernet.
6. AI Acceleration: Enhanced support for artificial intelligence (AI) workloads with dedicated hardware capabilities.
7. Reliability: Designed for robustness in critical applications, with features supporting fault tolerance and reliability.
These attributes make the 10AX016E4F27E3SG suitable for diverse applications such as data centers, telecommunications, and embedded systems.
1. Architecture: Utilizes a 10nm process technology for improved power efficiency and performance.
2. Logic Elements: Contains 16,000 adaptive logic modules (ALMs) for flexible logic implementation.
3. DSP Blocks: Integrates digital signal processing (DSP) blocks optimized for high-speed arithmetic operations.
4. Memory: Features on-chip memory resources, including SRAM and configuration memories for enhanced data handling.
5. I/O Capabilities: Supports high-speed I/O interfaces, allowing for a range of connectivity options including PCIe and Ethernet.
6. AI Acceleration: Enhanced support for artificial intelligence (AI) workloads with dedicated hardware capabilities.
7. Reliability: Designed for robustness in critical applications, with features supporting fault tolerance and reliability.
These attributes make the 10AX016E4F27E3SG suitable for diverse applications such as data centers, telecommunications, and embedded systems.
Package
The package type of the 10AX016E4F27E3SG is a F31 package, specifically a 484-pin Ball Grid Array (BGA). This type is commonly used for high-performance FPGA devices, providing efficient thermal and electrical performance.
Pinout
The 10AX016E4F27E3SG is an FPGA (Field-Programmable Gate Array) from Intel's Agilex series. It features a pin count of 484 pins. The FPGA provides various functionalities, including logic processing, signal processing, and interface connections. It supports high-speed data processing and connectivity options, making it suitable for applications in communications, automotive, and industrial sectors. The specific configuration of pins includes general-purpose I/O, power supply pins, and dedicated pins for configuration and clock signals, among others.
Manufacturer
The manufacturer of the 10AX016E4F27E3SG is Intel Corporation. Intel is a multinational technology company based in the United States, primarily known for its semiconductor products, including microprocessors, integrated circuits, and other hardware components. Established in 1968, Intel is a leading developer of technology that powers computing devices and systems across various sectors, including personal computing, data centers, and the Internet of Things (IoT). The 10AX016E4F27E3SG is part of Intel's Arria 10 FPGA (Field-Programmable Gate Array) series, which is designed for applications requiring high performance and flexibility in digital design. Intel plays a significant role in driving innovation in the tech industry and is a key player in the global semiconductor market.
Application
The 10AX016E4F27E3SG is a FPGA (Field-Programmable Gate Array) from Intel's Agilex series. Its application areas include telecommunications, data centers, automotive systems, industrial automation, and aerospace/defense. It is utilized for tasks such as real-time data processing, video processing, machine learning acceleration, and hardware acceleration in various embedded systems.
Equivalent
The 10AX016E4F27E3SG chip is an Intel/Altera FPGA (Field Programmable Gate Array). Equivalent products include:
1. Xilinx Kintex-7 FPGA (e.g., XCKU035)
2. Lattice ECP5 FPGA (e.g., LFE5U-25)
3. Microsemi SmartFusion 2 (e.g., M2S010)
Ensure to check specific requirements like power, I/O count, and performance for precise compatibility.
1. Xilinx Kintex-7 FPGA (e.g., XCKU035)
2. Lattice ECP5 FPGA (e.g., LFE5U-25)
3. Microsemi SmartFusion 2 (e.g., M2S010)
Ensure to check specific requirements like power, I/O count, and performance for precise compatibility.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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